Invention Grant
- Patent Title: Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars
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Application No.: US14598352Application Date: 2015-01-16
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Publication No.: US09299686B1Publication Date: 2016-03-29
- Inventor: Phillip V. Mann , Kevin M. O'Connell , Arvind K. Sinha , Karl Stathakis
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Joan Pennington
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/065 ; H01L23/522 ; H01L23/528 ; H01L23/532 ; H01L23/473 ; H01L25/00 ; H01L21/768 ; H01L21/48
Abstract:
A method and structures are provided for implementing individual integrated circuit chip attach in a three dimensional (3D) stack. A plurality of hollow copper pillars is formed, and the hollow copper pillars are coated with lead free solder using vapor deposition.
Information query
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