Invention Grant
US09299688B2 Packaged semiconductor devices and methods of packaging semiconductor devices
有权
封装的半导体器件和封装半导体器件的方法
- Patent Title: Packaged semiconductor devices and methods of packaging semiconductor devices
- Patent Title (中): 封装的半导体器件和封装半导体器件的方法
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Application No.: US14182574Application Date: 2014-02-18
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Publication No.: US09299688B2Publication Date: 2016-03-29
- Inventor: Chen-Hua Yu , Chung-Shi Liu , Chih-Fan Huang , Hui-Min Huang , Wei-Hung Lin , Ming-Da Cheng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/10
- IPC: H01L21/10 ; H01L21/105 ; H01L25/10 ; H01L21/56 ; H01L21/78 ; H01L23/538 ; H01L23/00 ; H01L21/683 ; H01L23/498
Abstract:
Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes forming a mask coating over a carrier, coupling an integrated circuit die over the mask coating, and disposing a molding compound around the integrated circuit die. The method includes forming an interconnect structure over the integrated circuit die and the molding compound.
Public/Granted literature
- US20150162316A1 Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices Public/Granted day:2015-06-11
Information query
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