Invention Grant
- Patent Title: Semiconductor structure and method for forming the same
- Patent Title (中): 半导体结构及其形成方法
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Application No.: US13400509Application Date: 2012-02-20
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Publication No.: US09299773B2Publication Date: 2016-03-29
- Inventor: Wing-Chor Chan
- Applicant: Wing-Chor Chan
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L29/423 ; H01L29/08

Abstract:
A semiconductor structure and a method for forming the same are provided. The semiconductor structure comprises a first semiconductor region, a second semiconductor region, a dielectric structure and a gate electrode layer. The first semiconductor region has a first type conductivity. The second semiconductor region has a second type conductivity opposite to the first type conductivity. The first semiconductor region is adjoined to the second semiconductor region. The dielectric structure is on the first semiconductor region and the second semiconductor region. The gate electrode layer is on the dielectric structure.
Public/Granted literature
- US20130214354A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2013-08-22
Information query
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