Invention Grant
- Patent Title: Ultrasound system and transducer assemblies
- Patent Title (中): 超声系统和换能器组件
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Application No.: US13943779Application Date: 2013-07-16
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Publication No.: US09301731B2Publication Date: 2016-04-05
- Inventor: Rich Henderson , Sean Murphy
- Applicant: Edan Instruments, Inc.
- Applicant Address: CN Shenzhen
- Assignee: EDAN INSTRUMENTS, INC.
- Current Assignee: EDAN INSTRUMENTS, INC.
- Current Assignee Address: CN Shenzhen
- Agency: Foley & Lardner LLP
- Agent Gilberto M. Villacorta; Brett P. Belden
- Main IPC: A61B8/00
- IPC: A61B8/00

Abstract:
An ultrasound system is disclosed. The ultrasound system includes an ultrasound device. The ultrasound device includes a housing, a control panel coupled to the housing, and a receiver assembly coupled to the housing, wherein the receiver assembly includes a first contact surface. The ultrasound system further includes a transducer assembly having an ultrasound probe and a cartridge, wherein the cartridge includes a second contact surface. The cartridge is configured to be removably received in a slot of the receiver assembly such that the cartridge is movable between a removed position, in which the transducer assembly is not connected to the ultrasound device, and an engaged position, in which the cartridge is positioned in the slot and the first contact surface is electrically coupled to the second contact surface.
Public/Granted literature
- US20150025389A1 ULTRASOUND SYSTEM AND TRANSDUCER ASSEMBLIES Public/Granted day:2015-01-22
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