Invention Grant
- Patent Title: Composite blocks with void spaces
- Patent Title (中): 具有空隙的复合块
-
Application No.: US13994787Application Date: 2011-12-01
-
Publication No.: US09302210B2Publication Date: 2016-04-05
- Inventor: Mark A. Stouffer , Eric C. Pemberton
- Applicant: Mark A. Stouffer , Eric C. Pemberton
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Scott A. Baum
- International Application: PCT/US2011/062852 WO 20111201
- International Announcement: WO2012/082388 WO 20120621
- Main IPC: B01D39/20
- IPC: B01D39/20 ; B29C44/02

Abstract:
A composite block that includes activated carbon particles bonded to one another with a polymeric binder. The block includes a tortuous porous network extending through the block article, the tortuous porous network having a plurality of void spaces interspersed throughout the network with the majority of void spaces each having an average diameter greater than the average diameter of the remainder of the porous network. A filter incorporates the composite block as a part thereof. A process of making a composite block includes mixing activated carbon, polymeric binder and pore forming material to provide a moldable mixture; placing the moldable mixture in a mold cavity; heating the mold cavity and the moldable mixture to melt the polymeric binder; cooling the mold to re-solidify the polymeric binder to form the composite block; and removing the composite block from the mold cavity.
Public/Granted literature
- US20130277299A1 COMPOSITE BLOCKS WITH VOID SPACES Public/Granted day:2013-10-24
Information query