A guide pin assembly for metal forming dies includes a cylindrical guide pin body with a tapered guide pin head to guide associated die members from converging and diverging positions. A base is used to secure the guide pin assembly to one of the die members in a reciprocating die. The base includes a tapered surface that coincides with the tapered surface of the guide pin head to transfer the directional force, caused by the diverging die members, on the guide pin assembly to other die components. The guide pin assembly includes additional dampening components between the guide pin assembly and the base to dampen the impact caused by the diverging die members.