A bus bar assembly comprises a plurality of conductive plate-shaped bus bars and a resin mold section in which a plurality of conductive plate-shaped bus bars are partially embedded. In a method for manufacturing the bus bar assembly, firstly a plurality of conductive plate-shaped bus bars are disposed within a cavity formed by a die such as to be stacked in a thickness direction Z with a predetermined amount of space therebetween. Second, a first end and a second end of each bus bar are respectively supported by jigs in the width direction Y. Next, the cavity in the die is filled with the insulating resin and the plurality of bus bars are molded into a single body. After that, jigs are removed from the bus bars and jig placement portions are formed in the resin mold section.