Invention Grant
- Patent Title: Sealing system for creating sealed letter by use of envelope sheet with bond part
- Patent Title (中): 密封系统用密封信封制作密封字母
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Application No.: US13765270Application Date: 2013-02-12
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Publication No.: US09302443B2Publication Date: 2016-04-05
- Inventor: Hirokazu Yabune
- Applicant: Riso Kagaku Corporation
- Applicant Address: JP Tokyo
- Assignee: RISO KAGAKU CORPORATION
- Current Assignee: RISO KAGAKU CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2012-037307 20120223
- Main IPC: G06F7/00
- IPC: G06F7/00 ; B31B1/88 ; B31B39/00 ; B43M5/04

Abstract:
A sealing system for creating a sealed letter by use of an envelope sheet with a bond part on a basis of a sealing setting. The sealing system includes a transmission amount detector configured to detect an amount of transmission of the envelope sheet being conveyed on a conveyance path, a bond position calculator configured to calculate a first bond position where the bond part exists in the envelope sheet on a basis of the amount of transmission as detected by the transmission amount detector, and a judgment unit configured to judge whether the envelope sheet is conveyed a correct way round in a conveyance direction of the envelope sheet, from the first bond position as calculated by the bond position calculator and a second bond position based on the sealing setting.
Public/Granted literature
- US20130225384A1 SEALING SYSTEM FOR CREATING SEALED LETTER BY USE OF ENVELOPE SHEET WITH BOND PART Public/Granted day:2013-08-29
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