Invention Grant
- Patent Title: Liquid ejection head substrate, liquid ejection head, and recording apparatus
- Patent Title (中): 液体喷射头基板,液体喷射头和记录装置
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Application No.: US14468088Application Date: 2014-08-25
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Publication No.: US09302479B2Publication Date: 2016-04-05
- Inventor: Yasuo Fujii , Tatsuhito Goden
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc. IP Division
- Priority: JP2013-175726 20130827
- Main IPC: B41J2/05
- IPC: B41J2/05 ; B41J2/14 ; B41J2/045

Abstract:
A liquid ejection head substrate according to an exemplary embodiment of the present invention includes a plurality of ejection heaters arranged in a first region, a drive circuit that is arranged in the first region and configured to supply electric energy to the plurality of ejection heaters, a signal supply circuit that is arranged in a second region and configured to supply an electric signal to the drive circuit, and a substrate heating heater including a first portion arranged in the first region and a second portion arranged in the second region, in which a resistance value per unit length along a direction of a current of the first portion is different from a resistance value per unit length along a direction of a current of the second portion.
Public/Granted literature
- US20150062252A1 LIQUID EJECTION HEAD SUBSTRATE, LIQUID EJECTION HEAD, AND RECORDING APPARATUS Public/Granted day:2015-03-05
Information query
IPC分类: