Invention Grant
- Patent Title: Vent hole barrier
- Patent Title (中): 排气孔屏障
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Application No.: US14394145Application Date: 2012-07-18
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Publication No.: US09302485B2Publication Date: 2016-04-05
- Inventor: Segi Gonzalez
- Applicant: Segi Gonzalez
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- International Application: PCT/US2012/047188 WO 20120718
- International Announcement: WO2014/014455 WO 20140123
- Main IPC: B41J2/175
- IPC: B41J2/175
Abstract:
An ink outlet is arranged to interconnect with a corresponding ink inlet device. A vent hole is formed next to the ink outlet. A vent hole barrier is arranged to be pushed open by the ink inlet device during interconnection.
Public/Granted literature
- US20150091984A1 Vent Hole Barrier Public/Granted day:2015-04-02
Information query
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