Invention Grant
- Patent Title: Thermal head, printer, and method of manufacturing thermal head
- Patent Title (中): 热敏头，打印机和制造热头的方法
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Application No.: US13898823Application Date: 2013-05-21
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Publication No.: US09302495B2Publication Date: 2016-04-05
- Inventor: Norimitsu Sanbongi , Keitaro Koroishi , Toshimitsu Morooka
- Applicant: Seiko Instruments Inc.
- Applicant Address: JP
- Assignee: SEIKO INSTRUMENTS INC.
- Current Assignee: SEIKO INSTRUMENTS INC.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2012-137796 20120619
- Main IPC: B41J2/15
- IPC: B41J2/15 ; B41J2/335 ; H01C17/00
Abstract:
A thermal head has a support substrate, an upper substrate arranged on the support substrate on one surface side thereof in a laminated state, and an intermediate layer arranged between the upper substrate and the support substrate to bond the upper substrate and the support substrate to each other. The intermediate layer has one of a through hole and a concave portion forming a cavity portion between the upper substrate and the support substrate. A heat generating resistor is formed on a surface of the upper substrate on a side opposite to the support substrate at a position opposed to the cavity portion. The intermediate layer is formed of a glass paste having a melting point lower than a firing temperature of the support substrate and higher than a melting temperature of the upper substrate.
Public/Granted literature
- US20130335500A1 THERMAL HEAD, PRINTER, AND METHOD OF MANUFACTURING THERMAL HEAD Public/Granted day:2013-12-19
Information query
IPC分类:
