Invention Grant
US09302902B2 Integrated heater on MEMS cap for wafer scale packaged MEMS sensors
有权
MEMS盖上的集成加热器，用于晶圆级封装的MEMS传感器
- Patent Title: Integrated heater on MEMS cap for wafer scale packaged MEMS sensors
- Patent Title (中): MEMS盖上的集成加热器，用于晶圆级封装的MEMS传感器
-
Application No.: US14176964Application Date: 2014-02-10
-
Publication No.: US09302902B2Publication Date: 2016-04-05
- Inventor: Goksen G. Yaralioglu , Martin Lim
- Applicant: InvenSense, Inc.
- Applicant Address: US CA San Jose
- Assignee: INVENSENSE, INC.
- Current Assignee: INVENSENSE, INC.
- Current Assignee Address: US CA San Jose
- Agency: Sawyer Law Group, P.C.
- Main IPC: H01L23/34
- IPC: H01L23/34 ; B81B7/00 ; B81C1/00 ; H01L23/00
Abstract:
A system and method for controlling temperature of a MEMS sensor are disclosed. In a first aspect, the system comprises a MEMS cap encapsulating the MEMS sensor and a CMOS die vertically arranged to the MEMS cap. The system includes a heater integrated into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor. In a second aspect, the method comprises encapsulating the MEMS sensor with a MEMS cap and coupling a CMOS die to the MEMS cap. The method includes integrating a heater into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor.
Public/Granted literature
- US20140151869A1 INTEGRATED HEATER ON MEMS CAP FOR WAFER SCALE PACKAGED MEMS SENSORS Public/Granted day:2014-06-05
Information query
IPC分类:
