Invention Grant
- Patent Title: Polishing composition
- Patent Title (中): 抛光组成
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Application No.: US14359357Application Date: 2013-03-28
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Publication No.: US09303191B2Publication Date: 2016-04-05
- Inventor: Koichiro Hosokawa , Yoshiharu Ota , Shoichiro Yoshida
- Applicant: NITTA HAAS INCORPORATED
- Applicant Address: JP Osaka
- Assignee: NITTA HAAS INCORPORATED
- Current Assignee: NITTA HAAS INCORPORATED
- Current Assignee Address: JP Osaka
- Agency: Clark & Brody
- International Application: PCT/JP2013/059311 WO 20130328
- International Announcement: WO2013/147046 WO 20131003
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/321 ; C09K3/14
Abstract:
The polishing composition of the present invention is a polishing composition for polishing a tungsten-containing metal layer formed on an insulating layer, the polishing composition comprising: abrasive grains; one or more halogen acids selected from the group consisting of iodic acid, iodous acid, and hypoiodous acid; a strong acid; a hydrogen-ion-supplying agent; and water.
Public/Granted literature
- US20150053887A1 POLISHING COMPOSITION Public/Granted day:2015-02-26
Information query
