Invention Grant
- Patent Title: Melt-solidified substance, copper alloy for melt-solidification and method of manufacturing the same
- Patent Title (中): 熔融固化物质,熔融凝固用铜合金及其制造方法
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Application No.: US12088822Application Date: 2005-09-30
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Publication No.: US09303300B2Publication Date: 2016-04-05
- Inventor: Keiichiro Oishi
- Applicant: Keiichiro Oishi
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI SHINDOH CO., LTD.
- Current Assignee: MITSUBISHI SHINDOH CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Griffin and Szipl PC
- International Application: PCT/JP2005/018107 WO 20050930
- International Announcement: WO2007/043101 WO 20070419
- Main IPC: C22C9/04
- IPC: C22C9/04 ; C22C9/00 ; B23K35/30 ; C22C1/06 ; C22C9/01 ; C22C9/02 ; C22C9/10

Abstract:
A melt-solidified substance includes melt-solidified portions formed by welding, build-up spray welding, metallizing or fusing. The melt-solidified portions have the alloy composition containing Zr: 0.0005 to 0.05 mass %, P: 0.01 to 0.34 mass %, Cu: the remainder and satisfying the relationship between the contents of P and Zr, [P]/[Zr]=0.3 to 20, and the mean grain size in the macrostructure after melt-solidification is 300 μm or less. If Fe and/or Ni are contained in the melt-solidified portion as inevitable impurities, the content of Fe or Ni is restricted to be 0.3 mass % or less when either Fe or Ni is contained, and the total content of Fe and Ni is restricted to be 0.4 mass % or less when both Fe and Ni are contained.
Public/Granted literature
- US20100297464A1 MELT-SOLIDIFIED SUBSTANCE, COPPER ALLOY FOR MELT-SOLIDIFICATION AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-11-25
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