Invention Grant
- Patent Title: Acidic gold alloy plating solution
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Application No.: US13292776Application Date: 2011-11-09
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Publication No.: US09303326B2Publication Date: 2016-04-05
- Inventor: Yutaka Morii , Masanori Orihashi
- Applicant: Yutaka Morii , Masanori Orihashi
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Agent John J. Piskorski
- Priority: JP2007-151013 20070606
- Main IPC: C25D3/62
- IPC: C25D3/62 ; C25D5/12
Abstract:
A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
Public/Granted literature
- US20120055802A1 ACIDIC GOLD ALLOY PLATING SOLUTION Public/Granted day:2012-03-08
Information query
