Invention Grant
- Patent Title: Bearing cup structure and thermal module thereof
- Patent Title (中): 轴承杯结构及其热模块
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Application No.: US13429850Application Date: 2012-03-26
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Publication No.: US09303651B2Publication Date: 2016-04-05
- Inventor: Meihua Yuan
- Applicant: Meihua Yuan
- Applicant Address: CN Shenzhen
- Assignee: Asia Vital Components (China) Co., Ltd.
- Current Assignee: Asia Vital Components (China) Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Nikolai & Mersereau, P.A.
- Agent C. G. Mersereau
- Main IPC: F04D19/00
- IPC: F04D19/00 ; F04D29/05 ; F16C35/00 ; F04D25/06 ; F04D29/056 ; F16C35/02 ; F04D29/60
Abstract:
A bearing cup structure and a thermal module thereof. The bearing cup structure includes a cup body and a retainer ring. The cup body has a fixing section, a receiving space and a shoulder section. The fixing section is formed at one end of the cup body. The shoulder section is formed in the receiving space. The retainer ring is formed with a hole in communication with the receiving space. With the bearing cup structure, the heat dissipation efficiency of the thermal module is increased and the assembling time is shortened to lower the manufacturing cost.
Public/Granted literature
- US20130251530A1 BEARING CUP STRUCTURE AND THERMAL MODULE THEREOF Public/Granted day:2013-09-26
Information query
