Invention Grant
- Patent Title: Bonding assembly
- Patent Title (中): 粘接组件
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Application No.: US14198936Application Date: 2014-03-06
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Publication No.: US09303670B2Publication Date: 2016-04-05
- Inventor: Henry E. Richardson , Jeffery Thomas Shantz , Alex Mangiapane
- Applicant: Zephyros, Inc.
- Applicant Address: US MI Romeo
- Assignee: Zephyros, Inc.
- Current Assignee: Zephyros, Inc.
- Current Assignee Address: US MI Romeo
- Agency: The Dobrusin Law Firm, PC
- Main IPC: B62D23/00
- IPC: B62D23/00 ; B62D27/00 ; F16B17/00 ; B62D27/02 ; B62D29/00
Abstract:
A device and method for the protection of a first member and second member from corrosion by utilizing a connector that bonds the members without allowing direct contact of the members.
Public/Granted literature
- US20140186100A1 BONDING ASSEMBLY Public/Granted day:2014-07-03
Information query
IPC分类:
