Invention Grant
- Patent Title: Light emitting module having heat conductive substrate
- Patent Title (中): 具有导热基板的发光模块
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Application No.: US14158207Application Date: 2014-01-17
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Publication No.: US09303855B2Publication Date: 2016-04-05
- Inventor: Takayoshi Moriyama , Kazunari Higuchi , Sumio Hashimoto , Shinichi Kumashiro
- Applicant: Toshiba Lighting & Technology Corporation , Kabushiki Kaisha Toshiba
- Applicant Address: JP Yokosuka-shi, Kanagawa-ken JP Minato-ku, Tokyo
- Assignee: Toshiba Lighting & Technology Corporation,Kabushiki Kaisha Toshiba
- Current Assignee: Toshiba Lighting & Technology Corporation,Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Yokosuka-shi, Kanagawa-ken JP Minato-ku, Tokyo
- Agency: Banner & Witcoff, Ltd.
- Priority: JP2008-142063 20080530; JP2009-071276 20090324
- Main IPC: H05K1/05
- IPC: H05K1/05 ; F21V29/00 ; F21S8/02 ; F21V19/00 ; F21V21/00 ; F21V17/12 ; F21Y101/02 ; H05K1/02

Abstract:
A lighting apparatus including at least one light-emitting element mounted on a first surface of a substrate, a heat conducting layer disposed on a second surface of the substrate opposite the first surface, and one or more holes extending from the first surface to the second surface of the substrate. A heat conductive and electrically non-conducting material covers an inner surface of the one or more holes, and is thermally connected to the heat conductive layer.
Public/Granted literature
- US20140133166A1 Light Emitting Module Having Heat Conductive Substrate Public/Granted day:2014-05-15
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