Invention Grant
US09303926B2 Condenser fin structures facilitating vapor condensation cooling of coolant
有权
冷凝器翅片结构有助于冷却液的冷凝冷凝
- Patent Title: Condenser fin structures facilitating vapor condensation cooling of coolant
- Patent Title (中): 冷凝器翅片结构有助于冷却液的冷凝冷凝
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Application No.: US13785236Application Date: 2013-03-05
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Publication No.: US09303926B2Publication Date: 2016-04-05
- Inventor: Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Agent Steven Chiu, Esq.; Kevin P. Radigan, Esq.
- Main IPC: F28D15/00
- IPC: F28D15/00 ; F28D15/02 ; F28F3/02 ; F28F3/12 ; H05K7/20

Abstract:
Vapor condensers and cooling apparatuses facilitating vapor condensation cooling of a coolant employed in cooling an electronic device or electronic subsystem. The vapor condenser includes a thermally conductive base structure having an operational orientation when the condenser is facilitating vapor condensate formation, and a plurality of thermally conductive condenser fins extending from the thermally conductive base structure. The plurality of thermally conductive condenser fins have a varying cross-sectional perimeter along at least a portion of their length. The cross-sectional perimeters of the plurality of thermally conductive condenser fins are configured to increase in a direction of condensate travel through the thermally conductive base structure.
Public/Granted literature
- US20130180687A1 CONDENSER FIN STRUCTURES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT Public/Granted day:2013-07-18
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