Invention Grant
- Patent Title: Heat spreader structure and manufacturing method thereof
- Patent Title (中): 散热器结构及其制造方法
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Application No.: US13176752Application Date: 2011-07-06
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Publication No.: US09303927B2Publication Date: 2016-04-05
- Inventor: Hsiu-Wei Yang , Ming-Tai Weng
- Applicant: Hsiu-Wei Yang , Ming-Tai Weng
- Applicant Address: TW New Taipei
- Assignee: Asia Vital Components Co., Ltd.
- Current Assignee: Asia Vital Components Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Nikolai & Mersereau, P.A.
- Agent C. G. Mersereau
- Priority: TW100119075A 20110531
- Main IPC: F28D15/04
- IPC: F28D15/04

Abstract:
A heat spreader structure and a manufacturing method thereof. The heat spreader structure includes a main body. The main body includes a first board body and a second board body corresponding to the first board body. The second board body is mated with the first board body to form the main body. The main body has a circulation area and a connection area. The circulation area is connected with the connection area to together define a chamber in which a working fluid is contained. The circulation area has a first capillary structure, while the connection area has a second capillary structure. In manufacturing, the heat spreader structure can be freely bent and shaped without damaging the internal capillary structures.
Public/Granted literature
- US20120305222A1 HEAT SPREADER STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-12-06
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