Invention Grant
- Patent Title: Thermal conduction principle and device for intercrossed structure having different thermal characteristics
- Patent Title (中): 具有不同热特性的交叉结构的导热原理和器件
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Application No.: US12607396Application Date: 2009-10-28
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Publication No.: US09303928B2Publication Date: 2016-04-05
- Inventor: Tai-Her Yang
- Applicant: Tai-Her Yang
- Agency: Bacon & Thomas, PLLC
- Main IPC: H05K7/20
- IPC: H05K7/20 ; B32B3/10 ; H01L23/373 ; B32B7/00 ; F28F13/00 ; A47J27/00 ; A47J27/022 ; A47J36/02 ; F28F21/08 ; F28F23/00 ; H01L23/36 ; H01L23/367 ; F28F13/14 ; F28F13/18

Abstract:
The present invention relates to relay thermal conductor made of material having better thermal conductivity coefficient, wherein which is thermal conductively coupled with heating or cooling first thermal body at one end or face thereof, and is coupled with interface thermal conductor having higher specific heat capacity at the other end or face thereof; the relay thermal conductor directly performs thermal conduction with second thermal body at another part thereof; and the interface thermal conductor having higher specific heat capacity is the thermal conducting carrier between the relay thermal conductor and the second thermal body.
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