Invention Grant
- Patent Title: High aspect ratio positioning system
- Patent Title (中): 高宽比定位系统
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Application No.: US12968669Application Date: 2010-12-15
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Publication No.: US09303971B1Publication Date: 2016-04-05
- Inventor: Stephen T. Butscher , Robert J. Atmur , Angelo Truncale , Joseph E. Justin , Thomas C. Williams
- Applicant: Stephen T. Butscher , Robert J. Atmur , Angelo Truncale , Joseph E. Justin , Thomas C. Williams
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Baldauff IP, LLC
- Agent Michael J. Baldauff, Jr.
- Main IPC: G01B7/30
- IPC: G01B7/30 ; G01C19/24 ; G01C21/00 ; G05D1/00

Abstract:
High aspect ratio positioning systems are disclosed herein. A high aspect ratio positioning system can be packaged in a thin package that can eliminate some bulky components typically associated with positioning systems such as pancake motors or other motors, geared resolvers, gear trains, and the like. Thus, the high aspect ratio positioning system can be used in applications where volume is limited, without sacrificing accuracy.
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