Invention Grant
- Patent Title: Substrate processing system and substrate processing program
- Patent Title (中): 基板加工系统和基板加工程序
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Application No.: US13456458Application Date: 2012-04-26
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Publication No.: US09303976B2Publication Date: 2016-04-05
- Inventor: Masahiro Uekita , Hiroshi Koizumi , Tomomichi Naka , Naoaki Sakurai , Eijiro Koike
- Applicant: Masahiro Uekita , Hiroshi Koizumi , Tomomichi Naka , Naoaki Sakurai , Eijiro Koike
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-102427 20110428
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G06F15/00 ; G01B11/06 ; G01N21/64 ; G01N21/66

Abstract:
According to one embodiment, a substrate processing system includes a measuring unit, a data processing unit, and a processing unit. The measuring unit is configured to measure information relating to a thickness dimension of a substrate. The substrate includes a light emitting unit and a wavelength conversion unit. The wavelength conversion unit includes a phosphor. The data processing unit is configured to determine processing information relating to a thickness direction of the wavelength conversion unit based on the measured information relating to the thickness dimension of the substrate and based on information relating to a characteristic of light emitted from the light emitting unit. The processing unit is configured to perform processing of the wavelength conversion unit based on the determined processing information.
Public/Granted literature
- US20120277896A1 SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING PROGRAM Public/Granted day:2012-11-01
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