A method for aligning a second pattern to a first pattern based on a first alignment structure on a first substrate is disclosed. The alignment structure has a different magnitude of the electrical characteristic than the substrate. A controller controls the relative position of an electrical probe with respect to the substrate to measure the electrical characteristic corresponding at a plurality of positions proximate the substrate. The measured electrical characteristics are used to identify the location of the alignment structure by identifying a difference between the measured electrical characteristic at a pair of the plurality of positions exceeding a predetermined threshold. A second substrate having the second pattern including a second alignment structure formed thereon is aligned to the first substrate by a controller based on the identified locations of the first and second alignment structures.