Invention Grant
- Patent Title: High current Kelvin connection and verification method
- Patent Title (中): 高电流开尔文连接和验证方法
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Application No.: US14317499Application Date: 2014-06-27
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Publication No.: US09304147B2Publication Date: 2016-04-05
- Inventor: Rodney Schwartz , Gary Rogers , Steven Clauter
- Applicant: Integrated Technology Corporation
- Applicant Address: US AZ Tempe
- Assignee: Integrated Technology Corporation
- Current Assignee: Integrated Technology Corporation
- Current Assignee Address: US AZ Tempe
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Main IPC: G01R31/20
- IPC: G01R31/20 ; G01R1/067 ; G01R27/20
Abstract:
A method and circuit for implementing high current capability Kelvin connections and measuring the resistance of the contacts and connections to verify that the conducting path is capable of carrying the high current without damage or degraded performance. Included as well is the means and circuit for efficiently dividing a high current test stimulus current into 2 paths with low losses and voltage drops.
Public/Granted literature
- US20140354319A1 HIGH CURRENT KELVIN CONNECTION AND VERIFICATION METHOD Public/Granted day:2014-12-04
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