Invention Grant
- Patent Title: Extreme ultraviolet lithography process and mask
- Patent Title (中): 极紫外光刻工艺和面膜
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Application No.: US14209163Application Date: 2014-03-13
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Publication No.: US09304390B2Publication Date: 2016-04-05
- Inventor: Yen-Cheng Lu , Shinn-Sheng Yu , Jeng-Horng Chen , Anthony Yen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G03F1/22
- IPC: G03F1/22 ; G03F7/20

Abstract:
A system and process of an extreme ultraviolet lithography (EUVL) is disclosed. The system and process includes receiving a mask with two states, which have 180 degree phase difference to each other. These different states are assigned to adjacent main polygons and adjacent assist polygons of the mask. A nearly on-axis illumination (ONI) with partial coherence σ less than 0.3 is utilized to expose the mask to produce diffracted lights and non-diffracted lights. A majority portion of the non-diffracted lights and diffracted light with diffraction order higher than 1 are removed. Diffracted light having +1-st and −1-st diffracted order are collected and directed by a projection optics box (POB) to expose a target.
Public/Granted literature
- US20140268091A1 Extreme Ultraviolet Lithography Process and Mask Public/Granted day:2014-09-18
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