Invention Grant
US09304412B2 Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method
有权
移动体驱动方法和移动体驱动系统,图案形成方法和装置,曝光方法和装置,装置制造方法和测量方法
- Patent Title: Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method
- Patent Title (中): 移动体驱动方法和移动体驱动系统,图案形成方法和装置,曝光方法和装置,装置制造方法和测量方法
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Application No.: US12196047Application Date: 2008-08-21
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Publication No.: US09304412B2Publication Date: 2016-04-05
- Inventor: Yuichi Shibazaki , Yuho Kanaya
- Applicant: Yuichi Shibazaki , Yuho Kanaya
- Applicant Address: JP Tokyo
- Assignee: NIKON CORPORATION
- Current Assignee: NIKON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Main IPC: G03B27/52
- IPC: G03B27/52 ; G03B27/58 ; G03F7/20 ; G03F9/00

Abstract:
A wafer stage is moved while monitoring a position using an X interferometer and a Y interferometer, and a Z position of a Y scale arranged on the wafer stage upper surface is measured using a surface position sensor. In this case, for example, from a difference of measurement results of two surface position sensors, tilt of the Y scale in the Y-axis direction is obtained. By measuring the tilt of the entire surface of a pair of Y scales, two-dimensional unevenness data of the scales are made. By correcting the measurement results of the position surface sensor using the unevenness data, and then using the corrected measurement results, it becomes possible to drive wafer stage WST two-dimensionally with high precision.
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