Invention Grant
- Patent Title: Thermal management
- Patent Title (中): 热管理
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Application No.: US13457927Application Date: 2012-04-27
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Publication No.: US09304520B2Publication Date: 2016-04-05
- Inventor: Chao-Wen Cheng , Edwin L. Harmon , Lien-Chia Chiu
- Applicant: Chao-Wen Cheng , Edwin L. Harmon , Lien-Chia Chiu
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Mahamedi Paradice Kreisman
- Main IPC: G05D23/19
- IPC: G05D23/19 ; G06F1/20 ; G06F1/16
Abstract:
An operation mode is determined based on user behavior data, an environmental data of the electronic device is determined and a system operating data of the electronic device is determined. A system control parameter can be adjusted based on the environmental data and the system operating data to regulate the heat generating element and/or the cooling element to achieve the operating mode.
Public/Granted literature
- US20130289792A1 Thermal Management Public/Granted day:2013-10-31
Information query
