Invention Grant
- Patent Title: Haptic solenoid and haptic solenoid mounting structure
- Patent Title (中): 触觉螺线管和触觉螺线管安装结构
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Application No.: US14271993Application Date: 2014-06-10
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Publication No.: US09304589B2Publication Date: 2016-04-05
- Inventor: Takami Sawaguchi
- Applicant: TOKYO PARTS INDUSTRIAL CO., LTD.
- Applicant Address: JP Gunma-ken
- Assignee: Tokyo Parts Industrial Co., Ltd.
- Current Assignee: Tokyo Parts Industrial Co., Ltd.
- Current Assignee Address: JP Gunma-ken
- Agency: Jordan and Hamburg LLP
- Priority: JP2013-137837 20130701; JP2014-79809 20140409
- Main IPC: H01H51/34
- IPC: H01H51/34 ; G06F3/01 ; G06F3/041

Abstract:
A haptic solenoid comprises a fixed member and a movable member that supports the fixed member with an elastic member, wherein the fixed member is fastened to a mounting device, and the movable member is linked to a vibrated body to transmit vibration by the movable member to the vibrated body. The fixed member includes a reference hole as a reference point for fastening to the mounting device using a screw. The movable member includes first adjustment holes that are larger than the first mounting holes provided on the vibrated body.
Public/Granted literature
- US20150002279A1 HAPTIC SOLENOID AND HAPTIC SOLENOID MOUNTING STRUCTURE Public/Granted day:2015-01-01
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