Invention Grant
- Patent Title: Conductive film
- Patent Title (中): 导电膜
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Application No.: US13944428Application Date: 2013-07-17
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Publication No.: US09304635B2Publication Date: 2016-04-05
- Inventor: Nozomi Fujino , Hiroyuki Takao
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki-shi
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2012-176852 20120809
- Main IPC: G06F3/044
- IPC: G06F3/044 ; B32B9/00 ; B32B7/12 ; B32B15/04 ; B32B15/20 ; B32B27/06 ; B32B27/32 ; C22C9/00 ; C22C32/00 ; C23C14/08 ; C23C14/56 ; C22C14/00

Abstract:
A conductive film includes an elongated film base, a first conductive layer, a second conductive layer and a third conductive layer in this order. The elongated film base has a longitudinal direction and a width direction orthogonal to the longitudinal direction. The width direction dimension of the elongated film base is greater than or equal to 1 m. The first conductive layer is an indium-based oxide layer. The second conductive layer is a metal layer. The third conductive layer is an oxidized metal layer having a thickness of 1 nm to 15 nm formed by sputter deposition.
Public/Granted literature
- US20140044942A1 CONDUCTIVE FILM Public/Granted day:2014-02-13
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