Invention Grant
US09304884B2 Test apparatus for testing two communication protocol chips based on power relay signals
有权
基于功率继电器信号测试两个通信协议芯片的测试装置
- Patent Title: Test apparatus for testing two communication protocol chips based on power relay signals
- Patent Title (中): 基于功率继电器信号测试两个通信协议芯片的测试装置
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Application No.: US14053243Application Date: 2013-10-14
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Publication No.: US09304884B2Publication Date: 2016-04-05
- Inventor: Chun-Hao Chu
- Applicant: Inventec (Pudong) Technology Corporation , INVENTEC CORPORATION
- Applicant Address: CN Shanghai TW Taipei
- Assignee: INVENTEC (PUDONG) TECHNOLOGY CORPORATION,INVENTEC CORPORATION
- Current Assignee: INVENTEC (PUDONG) TECHNOLOGY CORPORATION,INVENTEC CORPORATION
- Current Assignee Address: CN Shanghai TW Taipei
- Agency: Locke Lord LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: CN201310204925 20130528
- Main IPC: G06F11/22
- IPC: G06F11/22 ; G06F11/273

Abstract:
A test apparatus applicable to a server includes a processing unit, a control unit, a switch unit and a power relay unit. The processing unit outputs a reset signal and a processing signal. The control unit includes a first physical layer chip performing a first communication protocol, and a second physical layer chip performing a second communication protocol. The switch unit receives a working voltage and a processing signal to select a powering signal or a disconnection signal to output. The power relay unit receives the powering signal or the disconnection signal. When the power relay unit receives the powering signal, the server performs a test task on the first physical layer chip. When the power relay unit receives the disconnection signal and the processing unit outputs the reset signal to the control unit, the server performs the test task on the second physical layer chip.
Public/Granted literature
- US20140359358A1 TEST APPARATUS Public/Granted day:2014-12-04
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