Invention Grant
- Patent Title: Determining a layout and wiring estimation for a heating, ventilation, and air conditioning system of a building
- Patent Title (中): 确定建筑物的供暖,通风和空调系统的布局和布线估计
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Application No.: US13565521Application Date: 2012-08-02
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Publication No.: US09305136B2Publication Date: 2016-04-05
- Inventor: Sabari K M , Naga Sundar , Kirupakar J , Rajesh Kulandaivel Sankarapandian , Raveendran Manickam
- Applicant: Sabari K M , Naga Sundar , Kirupakar J , Rajesh Kulandaivel Sankarapandian , Raveendran Manickam
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Brooks, Cameron & Huebsch
- Main IPC: G06G7/48
- IPC: G06G7/48 ; G06F17/50

Abstract:
Devices, methods, and systems for determining a layout and wiring estimation for a heating, ventilation, and air conditioning (HVAC) system of a building are described herein. One method includes receiving information from a building information model associated with a building, receiving information from a pre-engineering tool associated with the building, and determining a layout and wiring estimation for an HVAC system of the building based, at least in part, on the information from the building information model and the information from the pre-engineering tool.
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