Invention Grant
US09305606B2 High-speed wireless serial communication link for a stacked device configuration using near field coupling
有权
用于使用近场耦合的堆叠设备配置的高速无线串行通信链路
- Patent Title: High-speed wireless serial communication link for a stacked device configuration using near field coupling
- Patent Title (中): 用于使用近场耦合的堆叠设备配置的高速无线串行通信链路
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Application No.: US12542528Application Date: 2009-08-17
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Publication No.: US09305606B2Publication Date: 2016-04-05
- Inventor: Mostafa Naguib Abdulla
- Applicant: Mostafa Naguib Abdulla
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G06F3/06
- IPC: G06F3/06 ; G11C5/04 ; G11C5/02 ; G06F13/38 ; G11C7/10
Abstract:
A memory module houses stacked memory devices and a memory controller each having a near-field interface coupled to loop antennas to communicate over-the-air data. A coil is formed on a memory device substrate or molded into a plastic mold to create near-field magnetic coupling with the stacked memory devices and the memory controller.
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