Invention Grant
- Patent Title: Multilayer ceramic electronic component and manufacturing method thereof
- Patent Title (中): 多层陶瓷电子元件及其制造方法
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Application No.: US13633508Application Date: 2012-10-02
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Publication No.: US09305686B2Publication Date: 2016-04-05
- Inventor: Byung Sung Kang , Byung Kil Seo
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Gyunggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0100773 20111004
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01C7/10 ; H01G4/008 ; H01L41/43 ; H01L41/047 ; H01L41/083 ; H01L41/293 ; H01L41/297 ; H01C7/00 ; H01F17/00 ; H01F27/29

Abstract:
There are provided a multilayer ceramic electronic component that does not require a heat treatment under a reduction atmosphere, and a manufacturing method thereof, wherein a conductive oxide is used as a material of internal and external electrodes and conductive layers having elasticity are formed on the external electrodes. In the case of the multilayer ceramic electronic component, a firing process may be performed under an air atmosphere, such that a manufacturing process may be simplified and manufacturing costs may be reduced.
Public/Granted literature
- US20130082575A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-04-04
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