Invention Grant
- Patent Title: Multilayer ceramic electronic component
- Patent Title (中): 多层陶瓷电子元件
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Application No.: US13902628Application Date: 2013-05-24
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Publication No.: US09305705B2Publication Date: 2016-04-05
- Inventor: Byung Jun Jeon , Kyu Ha Lee , Hyun Hee Gu , Chang Hoon Kim , Myung Jun Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Gyunggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0018275 20130220
- Main IPC: H01G4/00
- IPC: H01G4/00 ; H01G4/228 ; H01G4/005 ; H01G4/12 ; H01G4/30 ; H01G4/012 ; H01G4/232

Abstract:
There is provided a multilayer ceramic electronic component including a ceramic body having internal electrodes formed therein, external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes, and a buffer layer formed on surfaces of contact between the internal electrodes and the external electrodes among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the external electrode is denoted by T, a thickness of the buffer layer is denoted by t, a thickness of an active region is denoted by TA, and a thickness of the ceramic body is denoted by Tc, T≦10 μm, TA/TC>0.8, and t≦5 μm, so that a multilayer ceramic electronic component having excellent reliability may be realized.
Public/Granted literature
- US20140233149A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2014-08-21
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