Invention Grant
- Patent Title: Method and apparatus for liquid treatment of wafer-shaped articles
- Patent Title (中): 晶片状物品的液体处理方法及装置
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Application No.: US14455629Application Date: 2014-08-08
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Publication No.: US09305770B2Publication Date: 2016-04-05
- Inventor: Kei Kinoshita , Keisuke Sato
- Applicant: Kei Kinoshita , Keisuke Sato
- Applicant Address: AT Villach
- Assignee: LAM RESEARCH AG
- Current Assignee: LAM RESEARCH AG
- Current Assignee Address: AT Villach
- Agency: Young & Thompson
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/306 ; H01L21/687 ; H01L21/67
Abstract:
An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, a liquid dispenser for dispensing a treatment liquid onto a downwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and a gas dispenser for dispensing a gas within a gap defined between the downwardly-facing surface of the wafer-shaped article and an upper surface of the spin chuck.
Public/Granted literature
- US20140349489A1 METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER-SHAPED ARTICLES Public/Granted day:2014-11-27
Information query
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