Invention Grant
- Patent Title: Method of manufacturing an electronic component
- Patent Title (中): 电子部件的制造方法
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Application No.: US14135503Application Date: 2013-12-19
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Publication No.: US09305787B2Publication Date: 2016-04-05
- Inventor: Christoph Wilhelm Sele , Monica Johanna Beenhakkers , Gerwin Hermanus Gelinck , Nicolaas Aldegonda Jan Maria Van Aerle , Hjalmar Edzer Ayco Huitema
- Applicant: Creator Technology B. V.
- Applicant Address: NL Breda
- Assignee: Creator Technology B.V.
- Current Assignee: Creator Technology B.V.
- Current Assignee Address: NL Breda
- Main IPC: H01L21/283
- IPC: H01L21/283 ; H01L21/311 ; H01L51/00 ; H01L27/32 ; H01L51/05

Abstract:
A method of manufacturing an electric component disclosed. A first electrically conducting layer including a first electrode of the electric component is formed on a substrate. An interlayer of a dielectric material is formed on the first electrically conducting layer, the dielectric material including an electrically insulating material. A further layer of a dielectric material is deposited on the interlayer of dielectric material, the further layer including a photo-patternable electrically insulating material. Both the further layer and said interlayer are structured, wherein the further layer of the dielectric material is used as a mask for the interlayer. A second electrically conducting layer including a second electrode of the electric component is then formed.
Public/Granted literature
- US20140120721A1 METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT Public/Granted day:2014-05-01
Information query
IPC分类: