Invention Grant
- Patent Title: Die eject assembly for die bonder
- Patent Title (中): 模具焊接机的模具出口组件
-
Application No.: US13794387Application Date: 2013-03-11
-
Publication No.: US09305812B2Publication Date: 2016-04-05
- Inventor: Ali Imran Amin , Hamdan Hamid
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Frank D. Cimino
- Main IPC: B32B38/10
- IPC: B32B38/10 ; H01L21/67 ; H01L21/683 ; H01L21/687
Abstract:
Disclosed herein is a die eject assembly for a die bonder that may include a poker pin having an elongate shaft portion with a first end and a second end. The poker pin further includes a base portion having a first end and a second end. The base portion has a maximum diameter that is larger than the maximum diameter of the elongate shaft portion. The elongate shaft portion first end is fixedly attached to the base portion second end.
Public/Granted literature
- US20140251760A1 DIE EJECT ASSEMBLY FOR DIE BONDER Public/Granted day:2014-09-11
Information query
