Invention Grant
- Patent Title: Pressure transmitting device for bonding chips onto a substrate
- Patent Title (中): 用于将芯片接合到基板上的压力传递装置
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Application No.: US14374244Application Date: 2012-03-16
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Publication No.: US09305813B2Publication Date: 2016-04-05
- Inventor: Markus Wimplinger , Alfred Sigl
- Applicant: Markus Wimplinger , Alfred Sigl
- Applicant Address: AU St. Florian am Inn
- Assignee: EV GROUP E. THALLNER GMBH
- Current Assignee: EV GROUP E. THALLNER GMBH
- Current Assignee Address: AU St. Florian am Inn
- Agency: Kusner & Jaffe
- International Application: PCT/EP2012/054650 WO 20120316
- International Announcement: WO2013/135302 WO 20130919
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; H01L23/00
Abstract:
This invention relates to a pressure transmission apparatus for bonding a plurality of chips to a substrate. The pressure transmission apparatus includes a pressure body for applying a bonding force which acts in the bonding direction (B) to the chip. The pressure body has a first pressure side and an opposite second pressure side, both oriented to be transverse to the bonding direction (B). Fixing means are provided to attach to the periphery of the pressure transmission apparatus for fixing of the pressure transmission apparatus on a retaining body in the bonding direction (B). A sliding layer is provided for sliding motion of the pressure body transversely to the bonding direction (B).
Public/Granted literature
- US20150303082A1 PRESSURE TRANSMITTING DEVICE FOR BONDING CHIPS ONTO A SUBSTRATE Public/Granted day:2015-10-22
Information query
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