Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US14460428Application Date: 2014-08-15
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Publication No.: US09305818B2Publication Date: 2016-04-05
- Inventor: Yuji Kamikawa , Takafumi Tsuchiya , Koji Egashira
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Minato-Ku
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-Ku
- Agency: Burr & Brown, PLLC
- Priority: JP2009-38431 20090220
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/687

Abstract:
A substrate processing apparatus, which utilizes a first transfer apparatus and a second transfer apparatus which are configured to transfer a transfer container containing a plurality of substrates, along a first transfer path and a second transfer path whose lateral positions differ from each other, respectively, including a first load port where the transfer container is loaded and unloaded by the first transfer apparatus, and a second load port that is arranged stepwise with respect to the first load port, with the transfer container being loaded to and unloaded from the second load port by the second transfer apparatus.
Public/Granted literature
- US20140356106A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2014-12-04
Information query
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