Invention Grant
- Patent Title: Substrate processing system
- Patent Title (中): 基板加工系统
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Application No.: US14540124Application Date: 2014-11-13
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Publication No.: US09305819B2Publication Date: 2016-04-05
- Inventor: Yukiyoshi Saito , Tomohiro Kaneko
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2013-236271 20131114
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67

Abstract:
A first transfer apparatus unloads and transfers substrates from a cassette. A first accommodating unit accommodates the substrates. First substrate processing units divided into at least two groups and arranged in a height direction performs a process to the substrates. Second accommodating units respectively corresponding to the groups are arranged to be parallel with the first accommodating unit in the height direction. Second transfer apparatuses respectively corresponding to the groups unload and transfer the substrates from the second accommodating units corresponding to the same groups into the first substrate processing units of the same groups. Second substrate processing units respectively corresponding to the groups are arranged to be parallel with the first and second accommodating units in the height direction. A delivery apparatus delivers the substrates between the first and second accommodating units and transfers the substrates between the first accommodating unit and the second substrate processing units.
Public/Granted literature
- US20150132085A1 SUBSTRATE PROCESSING SYSTEM Public/Granted day:2015-05-14
Information query
IPC分类: