An apparatus for manufacturing an integrated circuit having a thick film metal layer includes an applicator configured to selectively apply a paste on a heat-conducting substrate. The paste includes particles of a first metal constituent of particles having sizes substantially within a narrow predetermined range about a predetermined size. The apparatus further includes a radio frequency (RF) generator to selectively inductively coupling RF energy into the paste. The first metal particles of the predetermined size are inductively couplable with the RF energy, and the frequency of the RF energy corresponds to a coupling frequency of the first metal particles of the predetermined size so that the inductive heating of the first metal particles is substantially maximized.