Invention Grant
- Patent Title: Semiconductor package with an indented portion and manufacturing method thereof
- Patent Title (中): 具有缩进部分的半导体封装及其制造方法
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Application No.: US14501592Application Date: 2014-09-30
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Publication No.: US09305829B2Publication Date: 2016-04-05
- Inventor: Jun Woo Myung , Sung Min Song
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2013-0162640 20131224
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/28 ; H01L23/12 ; H01L23/34 ; H01L21/56 ; H01L21/768 ; H01L23/13 ; H01L23/433 ; H01L23/31
Abstract:
A semiconductor package includes a substrate, at least one electronic device, a lead frame, and a molded portion. The substrate has at least one indented portion formed as a groove therein. The electronic device is mounted on one surface of the substrate. The lead frame is bonded to the substrate and electrically connected to the electronic device. The molded portion seals the lead frame and the electronic device and includes at least one through hole extending the indented portion.
Public/Granted literature
- US20150179552A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-06-25
Information query
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