Invention Grant
- Patent Title: Method of making a three dimensional NAND device
- Patent Title (中): 制造三维NAND器件的方法
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Application No.: US14539372Application Date: 2014-11-12
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Publication No.: US09305849B1Publication Date: 2016-04-05
- Inventor: Masanori Tsutsumi , Shigehiro Fujino , Sateesh Koka , Senaka Kanakamedala , Yanli Zhang , Raghuveer S. Makala , Rahul Sharangpani , George Matamis , Wei Zhao
- Applicant: SanDisk Technologies, Inc.
- Applicant Address: US TX Plano
- Assignee: SANDISK TECHNOLOGIES INC.
- Current Assignee: SANDISK TECHNOLOGIES INC.
- Current Assignee Address: US TX Plano
- Agency: The Marbury Law Group PLLC
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L21/28 ; H01L21/8239 ; H01L21/283 ; H01L27/115 ; H01L21/822

Abstract:
A monolithic three dimensional NAND string includes a semiconductor channel, an end part of the semiconductor channel extending substantially perpendicular to a major surface of a substrate, a plurality of control gate electrodes extending substantially parallel to the major surface of the substrate, a charge storage material layer located between the plurality of control gate electrodes and the semiconductor channel, a tunnel dielectric located between the charge storage material layer and the semiconductor channel, and a blocking dielectric containing a plurality of clam-shaped portions each having two horizontal portions connected by a vertical portion. Each of the plurality of control gate electrodes are located at least partially in an opening in the clam-shaped blocking dielectric, and a plurality of discrete cover oxide segments embedded in part of a thickness of the charge storage material layer and located between the blocking dielectric and the charge storage material layer.
Information query
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