Invention Grant
- Patent Title: Support mounted electrically interconnected die assembly
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Application No.: US13456126Application Date: 2012-04-25
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Publication No.: US09305862B2Publication Date: 2016-04-05
- Inventor: Simon J. S. McElrea , Marc E. Robinson , Lawrence Douglas Andrews, Jr.
- Applicant: Simon J. S. McElrea , Marc E. Robinson , Lawrence Douglas Andrews, Jr.
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/50 ; H01L23/34 ; H01L25/16 ; H01L21/50 ; H01L23/48 ; H01L23/00 ; H01L25/065 ; H01L29/06 ; H01L21/58
Abstract:
Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.
Public/Granted literature
- US20130099392A1 Support mounted electrically interconnected die assembly Public/Granted day:2013-04-25
Information query
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