Invention Grant
US09305868B2 Manufacturing method of forming an etch-back type semiconductor package with locking anchorages
有权
形成具有锁定锚固件的回蚀式半导体封装的制造方法
- Patent Title: Manufacturing method of forming an etch-back type semiconductor package with locking anchorages
- Patent Title (中): 形成具有锁定锚固件的回蚀式半导体封装的制造方法
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Application No.: US14579747Application Date: 2014-12-22
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Publication No.: US09305868B2Publication Date: 2016-04-05
- Inventor: Hwee-Seng Jimmy Chew , Shoa-Siong Lim , Kian-Hock Lim
- Applicant: ADVANPACK SOLUTIONS PTE LTD.
- Applicant Address: SG Singapore
- Assignee: ADVANPACK SOLUTIONS PTE LTD.
- Current Assignee: ADVANPACK SOLUTIONS PTE LTD.
- Current Assignee Address: SG Singapore
- Agency: Rabin & Berdo, P.C.
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12 ; H01L23/495 ; H01L21/48 ; H01L21/683 ; H01L21/56 ; H01L23/31 ; H01L23/00
Abstract:
A semiconductor package, a substrate and a manufacturing method thereof are provided. The substrate comprises a conductive carrier, a first metal layer and a second metal layer. The first metal layer is formed on the conductive carrier and comprises an lead pad having an upper surface. The second metal layer is formed on the first metal layer and comprises a bond pad. The bond pad overlaps and is in contact with the upper surface of the first metal layer. The upper surface of the lead pad is partially exposed. A part of the bond pad overhang outward from the edge of the lead pad.
Public/Granted literature
- US20150111345A1 ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-04-23
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