Invention Grant
- Patent Title: High pin count, small packages having heat-dissipating pad
- Patent Title (中): 高引脚数，小封装散热片
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Application No.: US14692283Application Date: 2015-04-21
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Publication No.: US09305871B2Publication Date: 2016-04-05
- Inventor: Sreenivasan K. Koduri
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/34 ; H05K1/02 ; H05K1/11 ; H01L23/31 ; H01L23/367 ; H01L23/482
Abstract:
A plastic package for high power has a pair of oblong metal pins exposed from a surface of the plastic, the pins straddling a corner of the package; each pin has a long axis, the long axes of the pair forming a non-orthogonal angle. Package further includes a chip assembly pad, acting as a thermal spreader and semiconductor chip.
Public/Granted literature
- US20150228566A1 HIGH PIN COUNT, SMALL PACKAGES HAVING HEAT-DISSIPATING PAD Public/Granted day:2015-08-13
Information query
IPC分类:
