Some embodiments relate to a semiconductor module having an integrated antenna structure that wirelessly transmits signals. The semiconductor module has a first die having a first far-back-end-of-the-line (FBEOL) metal layer with a ground plane connected to a ground terminal. A second die is stacked onto the first die and has a second FBEOL metal layer with an antenna exciting element that extends to a position that is vertically over the ground plane. One or more micro-bumps are vertically located between the first FBEOL metal layer and the second FBEOL metal layer. The one or more micro-bumps provide a radio frequency (RF) signal between the first FBEOL metal layer and the antenna exciting element of the second FBEOL metal layer. By using micro-bumps to connect the first and second die, the FBEOL metal layers are separated by a large spacing that provides for good performance of the integrated antenna structure.