Invention Grant
US09305889B2 Leadless integrated circuit package having standoff contacts and die attach pad
有权
无铅集成电路封装，具有支座触点和芯片贴片
- Patent Title: Leadless integrated circuit package having standoff contacts and die attach pad
- Patent Title (中): 无铅集成电路封装，具有支座触点和芯片贴片
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Application No.: US14287603Application Date: 2014-05-27
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Publication No.: US09305889B2Publication Date: 2016-04-05
- Inventor: Kirk Powell , John McMillan , Adonis Fung , Serafin P. Pedron, Jr.
- Applicant: UTAC Hong Kong Limited
- Applicant Address: HK Hong Kong
- Assignee: UTAC Hong Kong Limited
- Current Assignee: UTAC Hong Kong Limited
- Current Assignee Address: HK Hong Kong
- Agency: Winstead PC
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material.
Public/Granted literature
- US20140367865A1 LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DIE ATTACH PAD Public/Granted day:2014-12-18
Information query
IPC分类:
