Invention Grant
US09305890B2 Package having substrate with embedded metal trace overlapped by landing pad
有权
具有嵌入金属轨迹的衬底的封装与着陆焊盘重叠
- Patent Title: Package having substrate with embedded metal trace overlapped by landing pad
- Patent Title (中): 具有嵌入金属轨迹的衬底的封装与着陆焊盘重叠
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Application No.: US14155949Application Date: 2014-01-15
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Publication No.: US09305890B2Publication Date: 2016-04-05
- Inventor: Mirng-Ji Lii , Yu-Min Liang , Yu-Feng Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/488
- IPC: H01L23/488 ; H01L23/00
Abstract:
An embodiment package includes a conductive pillar mounted on an integrated circuit chip, the conductive pillar having a stepper shape, a metal trace partially embedded in a substrate, the metal trace having a bonding pad portion protruding from the substrate, and a solder feature electrically coupling the conductive pillar to the bonding pad portion of the metal trace.
Public/Granted literature
- US20150200172A1 Package Having Substrate With Embedded Metal Trace Overlapped by Landing Pad Public/Granted day:2015-07-16
Information query
IPC分类:
